Apr 07, 2024 Leave a message

What is the difference between alloy 59 and C276?

What is the difference between alloy 59 and C276?

 

 

CHEMICAL ANALYSIS

The chemical anlaysis of these alloys is as follows:

Alloy (UNS) Ni Cr Mo W Cu Fe Carbon
C276 (N10276) Bal 14.50-16.50 15.00-17.00 3.00-4.50 4.00-7.00 0.010max.
22 (N06022) Bal 20.00-22.50 12.50-14.50 2.50-3.50 2.00-6.00 0.015max.
59 (N06059) Bal 22.00-24.00 15.00-16.50 1.00 nom. 0.010max.
686 (N06686) Bal 19.00-23.00 15.00-17.00 3.00-4.40 1.00 max. 0.010max.
C2000® (N06200) Bal 22.00-24.00 15.00-17.00 1.30-1.90 3.00 max. 0.010max.

What is the difference between alloy 59 and C276?

What is the difference between alloy 59 and C276?

Unique advantages of these alloys
Each alloy is manufactured to provide a unique set of advantages regardless of its application. To help you determine which alloy will provide the benefits you need and stand the test of time, review the basic information below.

Alloy C22

The alloy's patent expired in 2001. Universal Alloy 22 is purchased with a controlled chemical composition: a minimum chromium content of 21.00%, a minimum molybdenum content of 13.00%, and a maximum carbon content of 0.005%.

Alloy 22

Alloy 22 has a higher chromium content than C276 and exhibits greater corrosion resistance in oxidizing aqueous media when high levels of chloride ions are present.

Alloy 59

The alloy has a chromium content of 23.00%. Alloy 59 has a higher molybdenum content than C276 and Alloy 22. It replaces tungsten in Alloys C276, 22 and 686 and improves the thermal stability of Alloy 59.

Alloy C2000

Alloy C2000 has the same chemical composition as Alloy 59, but with the addition of 1.60% copper. This enhances the alloy's corrosion resistance to reducing environments, but at the expense of reduced thermal stability and weldability.

686 alloy

The alloy is made from the highest possible combination of chromium, molybdenum and tungsten, giving the alloy excellent resistance to pitting and crevice corrosion. This comes at the expense of thermal stability and solderability.

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