1. What is the alternative name of pure copper?
2. What is the copper content of pure copper?
Commercial pure copper (e.g., C11000 in ASTM standard, Cu-ETP): Copper content ≥ 99.90%, with trace impurities (e.g., oxygen ≤ 0.04%, iron ≤ 0.005%, sulfur ≤ 0.004%) to balance processability and cost.
Oxygen-free pure copper (e.g., C10200, Cu-OF; C10100, Cu-OFHC): Copper content ≥ 99.95% (C10200) or ≥ 99.99% (C10100, "oxygen-free high conductivity" copper). These grades have extremely low oxygen (≤ 0.001%) and impurity levels, optimized for high electrical conductivity and corrosion resistance.
International standards (e.g., EN 1976:2016, GB/T 5231-2022): Pure copper grades (e.g., Cu-ETP, Cu-OF) consistently require copper content ≥ 99.90% as the minimum threshold for classification.




3. What is the typical hardness of pure copper?
Additional Technical Details:
Measurement standards: Hardness values are based on ASTM E10 (Brinell), ASTM E92 (Vickers), and ASTM E18 (Rockwell) test methods, using standard indentation parameters (e.g., 500 kg load for Brinell, 100 g load for Vickers).
Effect of impurities: Trace elements (e.g., iron, phosphorus) can slightly increase hardness but may reduce conductivity. High-purity OFHC copper (C10100) has marginally lower hardness in the annealed state (30–35 HB) compared to commercial ETP copper (35–45 HB) due to fewer impurities.
Post-processing impact: Annealing after cold working restores softness, while further cold deformation increases hardness proportionally (up to ~130 HB for extreme cold work, though ductility becomes very low).





