Purity-Centric Performance: For pure high-conductivity copper, electrical conductivity is directly determined by chemical purity. Impurities (e.g., Fe, Pb, S, O) scatter electrons, reducing conductivity. Thus, high-conductivity pure copper typically has a minimum copper content of 99.9% (e.g., C11000, T2) or even 99.99% (e.g., C10200 oxygen-free copper), with strict limits on impurity levels (e.g., Fe ≤0.05%, Pb ≤0.01%).
Microstructural Optimization: Processing techniques (e.g., annealing, cold working) influence conductivity indirectly. Full annealing (soft state, M/O) eliminates internal stresses and recrystallizes the microstructure, maximizing conductivity-whereas excessive cold working (hard state, Y/H) slightly reduces conductivity (by 2–5% IACS) due to lattice distortion.
Key Application Drivers: Valued for minimizing energy loss in electrical transmission and signal distortion in high-frequency systems. Critical for industries such as power generation, electronics, aerospace, and telecommunications.
Electrical conductivity: 97–101% IACS
Thermal conductivity: 380–395 W/m·K
Tensile strength: 200–350 MPa (varies by processing state)
Elongation: 5–50% (varies by processing state)









